Thermal Paste

HIGHEST THERMAL CONDUCTIVITY The surfaces of processor chips and cooler floors are covered with microscopic dents; ARCTIC‘s MX-4 thermal paste is composed of carbon microparticles which fill these cavities. This leads to extremely high thermal conductivity, guaranteeing that heat is dissipated quickly and efficiently...

Upgraded compound for better heat dissipationHigh CPU/GPU conductivity (9 W/m.k)Improves heat transfer from chipset to cooler base or heat pipesEasy to spread and remove without damaging the surface

The new Scythe Thermal Elixer 2 provides excellent heat transfer between the processor and heat sink without compromising the application. High-quality ingredients in combination with the Pure Aluminum Particle Hybrid technology reduce the thermal resistance significantly and allow a convenient and controlled application. It...